Fluon+ ADHESIVE

Fluon+ ADHESIVE are fluorinated adhesive resins made with Fluon ETFE or PFA. They are used in applications requiring strong adhesion to plastics and metals. These compounds exhibit high permeation resistance to many fluids and gases, especially automotive fuels.

Applications

Hoses and pipe inner walls
Laminating film
Printed circuit board materials

Main Product Types

Standard resin: LH-8000, AH-5000, AH-2000, AH-800, AH-700, EA-2000

Properties	Unit	LH-8000	AH-5000	AH-2000	AH-800	AH-700	EA-2000
MFR	g/10 min	4	26	25	25	13	16
Specific gravity	–	1.75	1.76	1.78	1.73	1.73	2.13
Melting point	°C	190 °C	225 °C	245 °C	255 °C	258 °C	300 °C

Conductive resin: AH-600C, AH-3000L, AH-800C, AH-700C

Properties	Unit	AH-600C	AH-3000L	AH-800X	AH-700C
MFR	g/10 min	4	6.5	5.5	2
Specific gravity	–	1.76	1.77	1.75	1.75
Melting point	°C	230°C	240°C	255°C	258°C

Fluon+™ EA-2000

EA-2000 adhesive resin is drawing attention for its implementation within 5G-compatible printed circuit boards that are used in higher frequency bands. While retaining inherent characteristics of fluoropolymers such as heat resistance and electrical characteristics, Fluon+™ EA-2000 provides superior adhesion, which enhances processing capabilities and the reliability of printed circuit boards.

Properties	Unit	AH-600C	AH-3000L	AH-800C	AH-700C
MFR	g/10 min	4	6.5	5.5	2
Specific gravity	–	1.76	1.77	1.75	1.75
Melting point	°C	230°C	240°C	255°C	258°C

In addition, Fluon+™ EA-2000 makes it possible to enhance the electrical characteristics of materials by being overlayed or dispersed on other materials. It has a low dielectric constant (2.0) that remains stable versus temperature and frequency, along with a low dissipation factor (0.001). In addition, EA-2000 has excellent adhesion to smooth copper foils, with its skin effect minimising loss and delay for high frequency applications. It also has a very low moisture uptake (0.03%)

Adhesiveness toward copper foil